TSMC Commits $100 Billion for Four More 2nm Fabs in Arizona
The new fabs bring TSMC closer to the 12-factory target under the recent US-Taiwan trade deal and may ease the capacity constraints that have pushed some customers, including NVIDIA and Apple, to consider alternative suppliers.
Reporting from 1 source: GIGAZINE.
TSMC CEO C.C. Wei announced the company will build at least four additional semiconductor manufacturing plants and advanced packaging facilities in Arizona, with an extra $100 billion investment. The new fabs will produce 2nm-class chips, adding roughly 20,000 wafers per month. The announcement follows a US-Taiwan trade agreement targeting 12 TSMC factories in the US. TSMC currently has six factories and two packaging facilities under construction in Arizona.
The additional $100 billion follows a US-Taiwan trade agreement that targets 12 TSMC factories and 4 packaging facilities in the United States. TSMC currently has six factories and two packaging facilities under construction in Arizona. The new announcement brings the total to ten factories, leaving two more to reach the target. The Arizona plants already produce chips for Apple and NVIDIA, with a reported yield rate four percentage points higher than TSMC's Taiwan facilities. But production capacity has reached its limit, delaying orders. The new fabs will add roughly 20,000 wafers per month of 2nm-class capacity. CEO Wei also pledged to build packaging factories at 13 locations in Taiwan, addressing concerns that US expansion would come at the expense of domestic investment.
Synthesized by Yomimono from the 1 cited source below, including Japanese-language reporting where cited, then editorially reviewed before publishing.
Sources
- GIGAZINE TSMCがアリゾナ州で4つの2nmファブを追加建設することを決定